ULLC0408FC05C Protek Devices, ULLC0408FC05C Datasheet
ULLC0408FC05C
Related parts for ULLC0408FC05C
ULLC0408FC05C Summary of contents
Page 1
... Weight 0.73 milligrams (Approximate) ✔ Solder Reflow Temperature: Lead-Free: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel 05221.R1 5/07 ULLC0408FC05C* UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY PIN CONFIGURATION 1 *U.S. Patent No. 6,867,436 www.protekdevices.com ...
Page 2
... Note 1: Device is bidirectional. 05221.R1 5/07 MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL RATED MINIMUM BREAKDOWN VOLTAGE @ 1mA (BR) VOLTS VOLTS 5.0 6.0 2 ULLC0408FC05C* VALUE T -55°C to 150° -55°C to 150°C STG @ 25°C Unless Otherwise Specified MAXIMUM LEAKAGE CURRENT @ µA 5.0 UNITS ° ...
Page 3
... GRAPHS 05221.R1 5/07 FIGURE 1 OVERSHOOT & CLAMPING VOLTAGE ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 2 CAPACITANCE VS REVERSE VOLTAGE V - Reverse Voltage - Volts R 3 ULLC0408FC05C* www.protekdevices.com ...
Page 4
... PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Ramp-up 155° 140° Preheat S t 25°C to Peak Ramp-up 30-60 seconds 15 seconds 4 ULLC0408FC05C* VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C ...
Page 5
... MOUNTING PAD LAYOUT - Option SOLDER PRINT 0.010” - 0.012” DIA. 05221.R1 5/07 PACKAGE OUTLINE TOP E F Metalized Die Contact END I A SOLDER PADS SOLDER MASK 5 ULLC0408FC05C* PACKAGE DIMENSIONS MILLIMETERS DIM A 0.56 NOM B 0.86 NOM C 0.99 ± 0.0254 E 0. 2.0 ± 0.0254 I 0.406 NOM NOTES: 1 ...
Page 6
... Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULLC0408FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., ULLC0408FC05C-T75-2). 6 PACKAGE DIMENSIONS MILLIMETERS INCHES 0.51 0.020 ...