SMM4F STMicroelectronics, SMM4F Datasheet - Page 7

• Manufacturer Part Number: SMM4F
• Description: High Junction Temperature Transil??
• Manufacturer: STMicroelectronics

SMM4F
3
Package information
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In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free. The category of second level Interconnect
is marked on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Table 5.
Figure 11. STmite flat footprint
(0.026)
0.65
Case: JEDEC DO-222AA molded plastic over Planar junction
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: For unidirectional types the band indicates cathode.
Flammability: Epoxy is rated UL94V-0
RoHS package
E1
E
(0.033)
0.85 0.63
STmite flat dimensions
dimensions
(.025)
(0.163)
4.13
c
millimeters
D
(0.079)
(inches)
2.00
b
L3
(.026)
0.65
L
(0.037)
0.95
L1
(0.077)
1.95
A
L2
b2
Figure 12. Marking information
Ref.
E1
b2
L1
L2
L3
A
D
E
b
L
c
Min.
0.80
0.40
0.70
0.10
1.75
3.60
2.80
0.50
2.10
0.45
0.20
Millimeters
y w w
x x x
Cathode bar ( unidirectional devices only )
Typ.
0.85
0.55
0.85
0.15
1.90
3.80
2.95
0.55
2.40
0.60
0.35
Dimensions
Max.
0.95 0.031 0.033 0.037
0.65 0.016 0.022 0.026
1.00 0.027 0.033 0.039
0.25 0.004 0.006 0.009
2.05 0.069 0.075 0.081
3.90 0.142 0.150 0.154
3.10 0.110 0.116 0.122
0.80 0.020 0.022 0.031
2.60 0.083 0.094 0.102
0.75 0.018 0.024 0.030
0.50 0.008 0.014 0.020
Package information
Min.
Inches
Y: Year
WW: week
XXX: Marking
Typ.
Max.
7/10