FSMD1206 DB Lectro Inc, FSMD1206 Datasheet - Page 4

• Manufacturer Part Number: FSMD1206
• Description: Surface Mountable Ptc Resettable Fuse Fsmd1206 Series
• Manufacturer: DB Lectro Inc

9. Pad Layouts、 、 、 、 Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp) 3
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Time maintained above:
Temperature(T
Time (t
Peak/Classification Temperature(Tp) : 260
Time within 5
Temperature (tp)
Ramp-Down Rate :
Time 25
Note 1: All temperatures refer to of the package,
NOTE : Specification subject to change without notice.
Product Specification and Approval Sheet
measured on the package body surface.
L
)
FUZETEC
℃ ℃ ℃ ℃
to Peak Temperature :
℃ ℃ ℃ ℃
L
)
of actual Peak :
TECHNOLOGY CO., LTD.
Pad dimensions (millimeters)
All 1206 Series
Device
Pb-Free Assembly
150
200
60-180 seconds
217
60-150 seconds
20-40 seconds
6
8 minutes max.
℃
℃
/ second max.
/ second max.
℃
℃
℃
℃
Nominal
2.00
A
Solder reflow
※
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard
3. Rework use standard industry practices.
4. Storage Envorinment : < 30
Caution:
1. If reflow temperatures exceed the
2. Devices are not designed to be wave soldered
Due to “Lead Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
methods and aqueous solvent.
recommended profile, devices may not meet
the performance requirements.
to the bottom side of the board.
Nominal
1.00
B
Version
NO.
Nominal
1.90
C
12
PQ18-01E
℃
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