MMFT1N10E ON Semiconductor, MMFT1N10E Datasheet - Page 8

• Manufacturer Part Number: MMFT1N10E
• Description: Medium Power Field Effect Transistor
• Manufacturer: ON Semiconductor

circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
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settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 18 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
Prior to placing surface mount components onto a printed
The melting temperature of solder is higher than the rated
For any given circuit board, there will be a group of control
Always preheat the device.
The delta temperature between the preheat and
When preheating and soldering, the temperature of the
soldering should be 100°C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
TYPICAL SOLDER HEATING PROFILE
SOLDER STENCIL GUIDELINES
SOLDERING PRECAUTIONS
http://onsemi.com
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or stainless steel with a typical thickness of 0.008 inches. The
stencil opening size for the SOT−223 package should be the
same as the pad size on the printed circuit board, i.e., a 1:1
registration.
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* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 −189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend
to heat first. The components on the board are then heated
by conduction. The circuit board, because it has a large
surface area, absorbs the thermal energy more efficiently,
then distributes this energy to the components. Because of
this effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
The soldering temperature and time shall not exceed
When shifting from preheating to soldering, the
After soldering has been completed, the device should
Mechanical stress or shock should not be applied during
260°C for more than 10 seconds.
maximum temperature gradient shall be 5°C or less.
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
cooling