Features
Mechanical Data
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Thermal Characteristics
Notes:
DS30488 Rev. 8 - 2
PowerDI is a trademark of Diodes Incorporated.
Operating Temperature Range
Storage Temperature Range
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2) T
Thermal Resistance Junction to Ambient Air (Note 3) T
Thermal Resistance Junction to Ambient Air (Note 4) T
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Guard Ring Die Construction for
Transient Protection
Low Forward Voltage Drop
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Case: PowerDI 5
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking: See Page 3
Weight: 0.094 grams (approximate)
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
1. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7.
Characteristic
Characteristic
@ T
A
= 25 C unless otherwise specified
A
A
A
= 25°C
= 25°C
= 25°C
e
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1 of 4
8A LOW VF SCHOTTKY BARRIER RECTIFIER
RIGHT PIN
Note: Pins Left & Right must
LEFT PIN
L1
L1
W
b1
b1
Symbol
V
be electrically connected
at the printed circuit board.
V
V
R(RMS)
I
FSM
RWM
V
RRM
I
Symbol
O
R
D2
b2
T
b2
R
R
R
R
D
D
e
e
STG
T
JS
JA
JA
JA
j
E2
b1
b1
E
L1
L
E
BOTTOMSIDE
HEAT SINK
A
E1
A2
A2
Typ
100
65
45
-65 to +125
-65 to +150
Value
120
35
25
8
PDS835L
Dim
All Dimensions in mm
A2
b1
b2
D2
E1
E2
L1
W
A
D
E
e
L
Max
3.0
PowerDI 5
PowerDI 5
Diodes Incorporated
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Min
3.05 NOM
1.84 NOM
3.55 NOM
PDS835L
Unit
V
V
A
A
°C/W
°C/W
Unit
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
C/W
C/W
°C
°C