MF359 Zarlink Semiconductor, MF359 Datasheet
MF359
Related parts for MF359
MF359 Summary of contents
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... Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved. 780nm - 55MHz High Performance LED MF359 MF359 ST MF359 SMA Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. Description The low thermal droop of this device allows baseband video transmission with minimum distortion ...
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... Peak Forward Current (duty cycle<50%,f>1MHz Reverse Voltage Soldering Temperature (2mm from the case for 10 sec.) Thermal Characteristics Parameter Thermal Resistance - Infinite Heat Sink Thermal Resistance - No Heat Sink Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength MF359 ° C Symbol Min Typ Max P 80 ...
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... Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/125 m 0. 100 0.5 0.75 1 Figure 3 - Relative Fiber-coupled Power vs Axial Displacement of Fiber MF359 62.5/125 m 100/140 m 0.275 0.29 120 W 250 W 1.25 1.5 1. Axial Displacem ent of Fiber ( Zarlink Semiconductor Inc. Data Sheet 200/230 m 0.37 400 W ...
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... Radial Displacem ent of Fiber ( m ) Figure 4 - Relative Fiber-coupled Power vs Radial Displacement of Fiber 100 80 50% Duty Cycle Figure 5 - Relative Fiber-coupled Power vs. Forward Current MF359 100 120 140 Forw ard Current (mA) 4 Zarlink Semiconductor Inc. Data Sheet ...
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... Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature 200 175 150 125 100 0.25 0.5 0.75 Figure 7 - Forward Current vs. Forward Voltage MF359 100 o Operating Tem perature ( C) 1 1.25 1.5 1.75 2 Forw ard Voltage (V) 5 Zarlink Semiconductor Inc. Data Sheet Inf inite Heat Sink ...
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... BOTTOM VIEW ( 2,54 0, 1,17 (3x 45° R0,2 max (4x) © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE 3,8 0,6 + 0,03 n 0,45 (3x) - 0,04 R2 Lens 1.5 0.05 R0,4 max NOTES:- 1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Header: Ni 2-3 µ min 1,32 µm. Previous package codes SIDE VIEW ...
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... For more information about all Zarlink products Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use ...