Copyright © 2007
6/26/2007 Rev C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
This UPS1040CTe3 in the Powermite3
tap dual Schottky rectifier that is also RoHS compliant offering high
current/power capabilities previously found only in much larger packages.
They are ideal for SMD applications that operate at high frequencies. In
addition to its size advantages, the Powermite3
metallic bottom that eliminates the possibility of solder flux entrapment
during assembly and a unique locking tab act as an efficient heat path to the
heat-sink mounting. Its innovative design makes this device ideal for use
with automatic insertion equipment.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Average Rectified Output Current
Peak Repetitive Reverse Voltage
Thermal Resistance (dual device)
Working Peak Reverse Voltage
on Rated Load@ T
Junctions-to Bottom (Case)
RMS Reverse Voltage
Junction Temperature
Storage Temperature
DC Blocking Voltage
ABSOLUTE MAXIMUM RATINGS AT 25º C
Rating
(UNLESS OTHERWISE SPECIFIED)
(UNLESS OTHERWISE SPECIFIED)
THERMAL CHARACTERISTICS
c
=90 ºC
D E S C R I P T I O N
®
package is a high efficiency center-
Symbol
V
V
V
T
R (RMS)
V
I
RWM
RRM
T
FSM
STG
I
o
R
J
R
θJC
®
Microsemi
package includes a full
-55 to +150
-55 to +125
Value
150
40
28
10
2.5
10 A Dual Schottky Barrier Rectifiers
Unit
ºC/Watt
ºC
ºC
V
V
A
A
UPS1040CTe3
• CASE: Void-free transfer molded
• FINISH: Annealed matte-Tin plating over
• POLARITY: See figure (left)
• MARKING: S1040CT•
• WEIGHT: 0.072 gram (approx.)
• Package dimension on last page
•
Very low thermal resistance package
Dual center-tap Schottky configuration with
common cathode
RoHS Compliant with e3 suffix part number
Guard-ring-die construction for transient
protection
Efficient heat path with Integral locking bottom
metal tab
Low forward voltage
Full metallic bottom eliminates flux entrapment
Compatible with automatic insertion
Low profile-maximum height of 1mm
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, and JANTXV are
available by adding MQ, MX, or MV prefixes
respectively to part numbers. For example,
designate MXUPS1040CTe3 for a JANTX
(consult factory for Tin-Lead plating).
Optional 100% avionics screening available by
adding MA prefix for 100% temperature cycle,
thermal impedance and 24 hours HTRB
(consult factory for Tin-Lead plating)
Switching and Regulating Power supplies.
Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
Elimination of reverse-recovery oscillations to
reduce need for EMI filtering
Charge Pump Circuits
Reduces reverse recovery loss with low I
Small foot print
thermosetting epoxy compound meeting
UL94V-0
copper and readily solderable per MIL-STD-
750 method 2026 (consult factory for Tin-Lead
plating)
Tape & Reel option: 16 mm tape per Standard
See mounting pad details on pg 5
MECHANICAL & PACKAGING
APPLICATIONS/BENEFITS
190 X 270 mils (1:1 Actual size)
EIA-481-B, 5000 on 13” reel
KEY FEATURES
Page 1
RM