FW330 Lineage Power, FW330 Datasheet - Page 18

• Manufacturer Part Number: FW330
• Description: Fw330 Power Modules Dc-dc Converters 36 To 75 Vdc Input, 3.6, 3.3, 2.5, 2.0, Or 1.8 Vdc Output; 180 W To 330 W
• Manufacturer: Lineage Power

36 to 75 Vdc Input, 3.6, 3.3, 2.5, 2.0, or 1.8 Vdc Output; 180 W to 330 W
Feature Descriptions
Thermal Warning Signal
The thermal warning (THERM) pin is a secondary-ref-
erenced, open-collector output that shorts to
SENSE(–) a few degrees before the module goes into
thermal shutdown.
When the module temperature cools, the thermal warn-
ing pin will open, but the unit will remain latched off until
the input power or the primary or secondary referenced
remote on/off is recycled for 1.0 second.
Temperature Monitor
As an option a temperature monitor signal can be pro-
vided instead of the thermal warning signal (using the
same pin). The temperature monitor signal provides a
dc voltage proportional to the temperature of the mod-
ule as indicated in the Feature Specifications table. For
example, on the FW330F1-T at 100 °C, the voltage on
the THERM pin would be 1.5 V. The temperature moni-
tor signal is referenced to the SENSE(–) pin on the
secondary and is supplied from a source impedance of
approximately 200 k¾. It is recommended that the
THERM pin be left open when not in use, although no
damage will result if the THERM pin is shorted to sec-
ondary ground.
Module ID
The module ID signal allows the user to electronically
identify the module part number. This feature is useful
during customer factory assembly, before power is
applied, to ensure that the correct module is inserted. A
resistor placed between the Mod ID pin and SENSE(–)
pin has a resistance that correlates to the module part
number, as indicated in the following table:
18
18
FW330S3R671-56
FW330F1
FW330F1-T
FW330F1-33T
FW330G71-56T
FW330D1
FW330Y1-33T
Module Part
Number
100 k¾
20.5 k¾
10 k¾
5.11 ¾
348 k¾
2490 ¾
681 ¾
Mod ID Resistance
(continued)
Thermal Considerations
Introduction
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. Peak temperature occurs
at the position indicated in Figure 29.
(1.20)
Note: Top view, measurements shown in millimeters and (inches).
Figure 29. Case Temperature Measurement
The temperature at this location should not exceed
100 °C. The maximum continuous case temperature
should be limited to a lower value for higher reliability.
The output power of the module should not exceed the
rated power for the module as listed in the Ordering
Information table.
Heat Transfer Without Heat Sinks
Derating curves for forced-air cooling without a heat
sink are shown in Figures 30 and 31. These curves can
be used to determine the appropriate airflow for a given
set of operating conditions. For example, if the unit with
airflow parallel to its longest side (longitudinal orienta-
tion) can dissipate 30 W of heat, the correct airflow in a
40 °C environment is 1 m/s (200 ft./min.).
30.5
Pin locations are for reference only.
V
V
ON/OFF
SYNC IN
SYNC OUT
CASE
I(+)
I(–)
Location
(3.45)
87.6
TEMPERATURE HERE
MEASURE CASE
April 3, 2008
Lineage Power
V
V
O(+)
O(–)
8-2823 (F)