NDM3001 Fairchild Semiconductor, NDM3001 Datasheet - Page 8

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NDM3001

Manufacturer Part Number
NDM3001
Description
3 Phase Brushless Motor Driver
Manufacturer
Fairchild Semiconductor
Datasheet

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Manufacturer:
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Quantity:
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NDM3001
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Typical Thermal and Electrical Characteristics
Figure 25. SOIC-16 3 Leadframe Device DC Power
Figure 27. N-Ch DC Drain Current Capability
4.5
3.5
2.5
4
3
3.5
2.5
1.5
0.5
3
2
1
0
0
Dissipation versus Copper Mounting Pad Area.
1c
1b
1c
1b
versus Copper Mounting Pad Area.
0.005
0.002
0.001
0.05
0.02
0.01
0.5
0.2
0.1
0.0001
1
0.2
0.2
2oz COPPER MOUNTING PAD AREA (in
2oz COPPER MOUNTING PAD AREA (in )
D = 0.5
0.4
Figure 29. Transient Thermal Response Curve
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
0.4
0.2
0.1
0.05
0.001
0.02
depending on the circuit board design.
0.01
Single Pulse
0.6
0.6
4.5"x5" FR-4 PCB
Ta = 25C
Still Air
Vgs =10V
4.5"x5" FR-4 PCB
Ta = 25C
Still Air
2
0.8
)
0.01
2
0.8
1a
1
1a
1
0.1
t , TIME (sec)
1
0.03
0.01
0.3
0.1
20
10
3
1
Figure 26. P-Ch DC Drain Current Capability versus
3.5
2.5
1.5
0.5
Figure 28. P-Ch Typical Safe Operating Area
3
2
0
1c
1b
0.8 1
Copper Mounting Pad Area.
.
1
R
SINGLE PULSE
J A
0.2
V
T
2oz COPPER MOUNTING PAD AREA (in
GS
±V
= See Note 1c
A
DS
= 25°C
= ±10V
2
, DRAIN-SOURCE VOLTAGE (V)
P(pk)
0.4
T - T
Duty Cycle, D = t
1 0
R
J
R
JA
t
5
1
A
JA
(t) = r(t) * R
t
= P * R
2
= See Note 1c
0.6
10
JA
1
/ t
4.5"x5" FR-4 PCB
Ta = 25C
Still Air
Vgs = -10V
(t)
JA
1 0 0
2
2
0.8
)
3 0 0
30
NDM3001 Rev.C
.
1a
1
50

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