NTD4810NH ON Semiconductor, NTD4810NH Datasheet - Page 7

• Manufacturer Part Number: NTD4810NH
• Description: Power Mosfet 30 V, 54 A, Single Nchannel, Dpak/ipak
• Manufacturer: ON Semiconductor

SEATING PLANE
V
S
F
1
B
R
G
4
2
V
3
W
F
L
A
K
G
D
2 PL
0.13 (0.005)
B
R
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
0.228
J
5.80
M
K
A
C
D
T
−T−
3 PL
PACKAGE DIMENSIONS
0.13 (0.005) W
SOLDERING FOOTPRINT*
3 IPAK, STRAIGHT LEAD
E
0.244
0.101
6.20
2.58
SEATING
PLANE
U
http://onsemi.com
J
CASE 369AC−01
H
CASE 369C−01
NTD4810NH
ISSUE O
ISSUE O
C
DPAK
7
E
0.118
3.0
0.063
1.6
SCALE 3:1
Z
6.172
0.243
inches
mm
NOTES:
1.. DIMENSIONING AND TOLERANCING
2.. CONTROLLING DIMENSION: INCH.
3. SEATING PLANE IS ON TOP OF
4. DIMENSION A DOES NOT INCLUDE
PER ANSI Y14.5M, 1982.
DAMBAR POSITION.
DAMBAR POSITION OR MOLD GATE.
DIM
W
A
B
C
D
G
H
K
R
E
F
J
V
NOTES:
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.134
0.180
0.035
0.000
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
MIN
0.090 BSC
PER ANSI Y14.5M, 1982.
INCHES
DIM
A
B
C
D
G
H
K
R
U
E
F
J
L
S
V
Z
0.245
0.265
0.094
0.035
0.023
0.043
0.040
0.023
0.142
0.215
0.050
0.010
MAX
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.102
0.180
0.025
0.020
0.035
0.155
MIN
0.180 BSC
0.090 BSC
INCHES
MILLIMETERS
0.000
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
3.40
4.57
0.89
0.245
0.265
0.094
0.035
0.023
0.045
0.040
0.023
0.215
0.040
0.050
MIN
0.114
MAX
2.29 BSC
−−−
−−−
MAX
6.22
6.73
2.38
0.88
0.58
1.09
1.01
0.58
3.60
5.46
1.27
0.25
MILLIMETERS
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
2.60
4.57
0.63
0.51
0.89
3.93
MIN
4.58 BSC
2.29 BSC
MAX
6.22
6.73
2.38
0.88
0.58
1.14
1.01
0.58
2.89
5.45
1.01
1.27
−−−
−−−