MTB75N03HDL ON Semiconductor, MTB75N03HDL Datasheet - Page 8

• Manufacturer Part Number: MTB75N03HDL
• Description: Power Mosfet 75 Amps, 25 Volts, Logic Level
• Manufacturer: ON Semiconductor

total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
function of the drain pad size. These can vary from the
minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a
surface mount device is determined by T
maximum rated junction temperature of the die, R
thermal resistance from the device junction to ambient, and
the operating temperature, T
on the data sheet, P
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
one can calculate the power dissipation of the device. For a
D
2
Surface mount board layout is a critical portion of the
The power dissipation for a surface mount device is a
The values for the equation are found in the maximum
PAK device, P
INFORMATION FOR USING THE D
P
D
RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
D
D
is calculated as follows.
=
can be calculated as follows:
T
J(max)
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
A
R
. Using the values provided
JA
10.66
0.42
− T
Figure 16. Thermal Resistance versus Drain Pad
70
60
50
40
30
20
A
0
Area for the D
2
J(max)
A
0.33
8.38
2.5 Watts
of 25 C,
3.5 Watts
4
A, AREA (SQUARE INCHES)
http://onsemi.com
MTB75N03HDL
JA
, the
, the
5 Watts
2
17.02
0.63
6
PAK Package (Typical)
Board Material = 0.0625
G−10/FR−4, 2 oz Copper
2
8
PAK SURFACE MOUNT PACKAGE
8
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 2.5 Watts. There are
other alternatives to achieving higher power dissipation
from the surface mount packages. One is to increase the
area of the drain pad. By increasing the area of the drain
pad, the power dissipation can be increased. Although one
can almost double the power dissipation with this method,
one will be giving up area on the printed circuit board
which can defeat the purpose of using surface mount
technology. For example, a graph of R
area is shown in Figure 17.
The 50 C/W for the D
0.12
3.05
10
12
2.032
1.016
0.08
0.04
P
T
D
A
14
= 150 C − 25 C
= 25 C
6.096
inches
0.24
mm
16
50 C/W
2
PAK package assumes the use of
= 2.5 Watts
JA
versus drain pad