MTB9N25E ON Semiconductor, MTB9N25E Datasheet - Page 10

• Manufacturer Part Number: MTB9N25E
• Description: Tmos Power Fet 9.0 Amperes, 250 Volts
• Manufacturer: ON Semiconductor

circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
SC−59, SC−70/SOT−323, SOD−123, SOT−23, SOT−143,
SOT−223, SO−8, SO−14, SO−16, and SMB/SMC diode
packages, the stencil opening should be the same as the pad
size or a 1:1 registration. This is not the case with the DPAK
and D
solder
“tombstoning” may occur due to an excess of solder. For
these two packages, the opening in the stencil for the paste
should be approximately 50% of the tab area. The opening
for the leads is still a 1:1 registration. Figure 17 shows a
typical stencil for the DPAK and D
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
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Prior to placing surface mount components onto a printed
The melting temperature of solder is higher than the rated
Always preheat the device.
The delta temperature between the preheat and
When preheating and soldering, the temperature of the
The soldering temperature and time shall not exceed
soldering should be 100°C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
260°C for more than 10 seconds.
2
PAK packages. If one uses a 1:1 opening to screen
onto
the
drain
pad,
misalignment
2
PAK packages. The
SOLDER STENCIL GUIDELINES
SOLDERING PRECAUTIONS
http://onsemi.com
and/or
10
pattern of the opening in the stencil for the drain pad is not
critical as long as it allows approximately 50% of the pad to
be covered with paste.
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•
•
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
* Due to shadowing and the inability to set the wave height
to incorporate other surface mount components, the D
is not recommended for wave soldering.
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When shifting from preheating to soldering, the
After soldering has been completed, the device should
Mechanical stress or shock should not be applied during
maximum temperature gradient shall be 5°C or less.
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
cooling.
Figure 17. Typical Stencil for DPAK and
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D
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2
PAK Packages
SOLDER PASTE
OPENINGS
STENCIL
2
PAK