NE960R5 Renesas Electronics Corporation., NE960R5 Datasheet - Page 8

• Manufacturer Part Number: NE960R5
• Description: 0.5 W X, Ku-band Power Gaas Mes Fet
• Manufacturer: Renesas Electronics Corporation.

RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
CHIP HANDLING
DIE ATTACHMENT
attach is not recommended.
BONDING
less in diameter.
kept within a 280 C_5 minute curve. If longer periods are required, the temperature should be lowered.
PRECAUTIONS
environment.
grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of
static discharge.
8
Partial Heating
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Die attach can be accomplished with a Au-Sn (300 10 C) performs in a forming gas environment. Epoxy die
Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 to 8 % elongation) 30 microns or
Bonding should be performed with a wedge tip that has a taper of approximately 15 %.
Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be
The user must operate in a clean, dry environment.
The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean
The bonding equipment should be periodically checked for sources of surge voltage and should be properly
Soldering Method
Pin temperature: 260 C
Time: 5 seconds or less (per pin row)
Exposure limit: None
Preliminary Data Sheet P14387EJ1V0DS00
Soldering Conditions
Note
Recommended Condition Symbol
For soldering methods and
NE960R5 SERIES
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