QST102 STMicroelectronics, QST102 Datasheet - Page 25

• Manufacturer Part Number: QST102
• Description: Capacitive Touch Sensor Device 2 Keys With Individual Key State Outputs
• Manufacturer: STMicroelectronics

QST102
7.1
Soldering information
In accordance with the RoHS European directive, all STMicroelectronics packages have
been converted to lead-free technology, named ECOPACK™.
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Backward and forward compatibility
The main difference between Pb and Pb-free soldering process is the temperature range.
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Table 20.
1. Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is
Sn (pure Tin)
compatible with their Lead-free soldering process.
ECOPACK™ packages are qualified according to the JEDEC STD-020C compliant
soldering profile.
Detailed information on the STMicroelectronics ECOPACK™ transition program is
available on www.st.com/stonline/leadfree/, with specific technical Application notes
covering the main technical aspects related to lead-free conversion (AN2033, AN2034,
AN2035, and AN2036).
ECOPACK™ DFN8 packages are fully compatible with Lead (Pb) containing soldering
process (see application note AN2034).
Plating material devices
Soldering compatibility (wave and reflow soldering process)
Pb solder paste
Yes
Package mechanical data
Pb-free solder paste
Yes
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