2DAA-F6R Bourns, Inc., 2DAA-F6R Datasheet

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2DAA-F6R

Manufacturer Part Number
2DAA-F6R
Description
Integrated Passive & Active Device
Manufacturer
Bourns, Inc.
Datasheet
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
The 2DAA-F6R device provides ESD protection for the I/O
port of portable electronic devices such as cell phones,
modems and PDAs. The device incorporates four TVS
unidirectional diodes configured for interfacing to external
lines.
The ESD protection provided by the component enables
an I/O port to withstand a minimum ±8 KV Contact / ±15 KV
Air Discharge per the ESD test method specified in IEC
61000-4-2. The device measures 1.00 mm x 1.50 mm and
is available in a 6 bump Flip Chip package intended to be
mounted directly onto an FR4 printed circuit board. The
Flip Chip device meets typical thermal cycle and bend test
specifications without the use of an underfill material.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Electrical Characteristics
(T
Per TVS Diode Specification
Capacitance @ 0 V 1 MHz
Rated Standoff Voltage
Breakdown Voltage @ 1 mA
Clamping Voltage
Leakage Current @ 5 V
ESD Protection: IEC 61000-4-2
Surge Protection: IEC 61000-4-5
Thermal Characteristics
(T
Operating Temperature Range
Storage Temperature Range
Peak Pulse Power (t
General Information
Electrical & Thermal Characteristics
A
A
= 25 °C unless otherwise noted)
@ I
@ I
= 25 °C unless otherwise noted)
Contact Discharge
Air Discharge
8/20 µs - Level 2 (Line - Gnd)
8/20 µs - Level 3 (Line - Line)
P
PP
= 5 A t
= 24 A t
P
= 8/20 µs
P
= 8/20 µs
P
= 8/20 µs)
2DAA-F6R - Integrated Passive & Active Device
Features
Lead free versions available
RoHS compliant (lead free version)*
ESD protection > 25k volts
Protects four unidirectional lines
Small SMT package
Symbol
V
T
V
P
V
V
T
C
I
STG
WM
BR
R
PP
C
C
J
Minimum
120
±15
-40
-55
6.0
±8
24
24
SOLDER
BUMPS
Nominal
150
5.0
25
25
1
Applications
Cell phones
PDAs and notebooks
Digital cameras
MP3 players and GPS
Maximum
+150
+85
180
300
9.5
11
10
SILICON
DIE
Unit
pF
µA
kV
kV
°C
°C
W
A
A
V
V
V
V

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2DAA-F6R Summary of contents

Page 1

... General Information The 2DAA-F6R device provides ESD protection for the I/O port of portable electronic devices such as cell phones, modems and PDAs. The device incorporates four TVS unidirectional diodes configured for interfacing to external lines. The ESD protection provided by the component enables an I/O port to withstand a minimum ±8 KV Contact / ±15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2 ...

Page 2

... Daisy-Chain test device. A 25-Pin Daisy Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This array featuring 0.5 mm pitch solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2DAA-F6R and is thus deemed suitable for Thermal Cycle testing. ...

Page 3

... Integrated Passive & Active Device Block Diagram The CSP device block diagram below includes the pin names and basic electrical connections associated with each channel. EXT1 GND EXT2 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ...

Page 4

... Integrated Passive & Active Device Device Pin Out The pin-out for the device is shown below with the bumps facing up EXT4 A EXT1 GND x 2 Packaging The surface mount product is packaged Tape and Reel format per EIA-481 standard. ...

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