2DAD-C5R Bourns, Inc., 2DAD-C5R Datasheet

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2DAD-C5R

Manufacturer Part Number
2DAD-C5R
Description
2dad-c5r - Integrated Passive & Active Device Using Csp
Manufacturer
Bourns, Inc.
Datasheet
1.2DAD-C5R.pdf (4 pages)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
The 2DAD-C5R device, manufactured using Thin Film on
Silicon technology, provides ESD protection for the
external ports of portable electronic devices such as cell
phones, modems and PDAs.
The ESD protection provided by the component enables
a data port to withstand a minimum ±8 KV Contact /
±15 KV Air Discharge per the ESD test method specified
in IEC 61000-4-2. The device measures 1.00 mm x 1.33
mm and is available in a 5 bump CSP package intended
to be mounted directly onto an FR4 printed circuit board.
The CSP device meets typical thermal cycle and bend test
specifications without the use of an underfill material.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Electrical Characteristics
(T
Capacitance @ 2.5 V 1 MHz
Rated Standoff Voltage
Breakdown Voltage @ 1 mA
Forward Voltage @ 10 mA
Leakage Current @ 3.3 V
ESD Protection: IEC 61000-4-2
Thermal Characteristics
(T
DC Power Rating
Operating Temperature Range
Storage Temperature Range
General Information
Electrical & Thermal Characteristics
A
A
= 25 °C unless otherwise noted)
= 25 °C unless otherwise noted)
Contact Discharge
Air Discharge
2DAD-C5R - Integrated Passive & Active Device using CSP
Features
Lead free versions available
RoHS compliant (lead free version)*
ESD protection
Protects four lines
Low capacitance 15 pF
Symbol
V
T
V
V
T
C
I
P
STG
WM
BR
R
F
J
Minimum
±15
-40
-55
6.0
±8
12
SOLDER
BUMPS
Nominal
5.0
0.8
15
25
25
Applications
Cell phones
PDAs and notebooks
MP3 players
Maximum
+150
+85
200
0.1
18
SILICON
DIE
Unit
mW
pF
µA
kV
kV
°C
°C
V
V
V

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2DAD-C5R Summary of contents

Page 1

... Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Features Lead free versions available RoHS compliant (lead free version)* ESD protection Protects four lines Low capacitance 15 pF 2DAD-C5R - Integrated Passive & Active Device using CSP SOLDER BUMPS Symbol Minimum ...

Page 2

... Daisy-Chain test device. A 25-Pin Daisy Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This array featuring 0.5 mm pitch solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2DAD-C5R and is thus deemed suitable for Thermal Cycle testing. ...

Page 3

... Integrated Passive & Active Device using CSP Block Diagram The CSP device block diagram below includes the pin names and basic electrical connections associated with each channel. EXT1 GND EXT4 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ...

Page 4

... Integrated Passive & Active Device using CSP Device Pin Out The pin-out for the device is shown below with the bumps facing up EXT2 B EXT1 A GND Packaging The surface mount product is packaged Tape and Reel format per EIA-481 standard. ...

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