NJL6163R New Japan Radio Co.,Ltd, NJL6163R Datasheet - Page 4

• Manufacturer Part Number: NJL6163R
• Description: High Speed Pin Photo Diode
• Manufacturer: New Japan Radio Co.,Ltd

NJL6163R
1. Soldering to actual circuit board
2. Cleaning
3. Attention in handling
4. Storage
- 4 -
Avoid washing of the device after soldering by reflow method.
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
Soldering condition
Soldering Method
3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
1) Reflow Method
2) Reflow Method (In case of infrared heating)
3) The other method
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
- Heated condition of plastic package.
important to place the device to the optimum position to the object.
Lower than 240 C of maximum surface temperature, less than 30 seconds of time kept higher than 200 C.
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
- Temperature profile : Same to the above
temperature will be higher than lead itself.
Recommended temperature profile of its method.
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
Preparatory heating condition
Recommended soldering temperature : 230
Slowly cool down right after soldering.
Soldering to be done within twice under this condition.
( C)
250
200
150
100
50
0
Preparatory heating
60
240 C max.
~ 120 sec.
PRECAUTION FOR HANDLING
: 120
~ 150 C about 60 sec.
~ 240 C about 3 ~ 5 sec.
Less than
3
30 sec.
~ 5 sec.
Time