HVC145 Renesas Electronics Corporation., HVC145 Datasheet
HVC145
Related parts for HVC145
HVC145 Summary of contents
Page 1
To our customers, Old Company Name in Catalogs and Other Documents st On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the ...
Page 2
All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm ...
Page 3
... An optimal solution for antenna switching in mobile phones. • Low capacitance 0.45 pF max) • Low forward resistance. (rf = 1.8 Ω max) • Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Ordering Information Type No. HVC145 Pin Arrangement Rev.3.00 Dec 07, 2004 page Laser Mark T5 Cathode mark ...
Page 4
... HVC145 Absolute Maximum Ratings Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current I R Forward voltage V F Capacitance C Forward resistance ESD-Capability * — > 100 Note: 1. Failure criterion Rev.3.00 Dec 07, 2004 page ...
Page 5
... HVC145 Main Characteristic - 75° 25° –25°C - 0.2 0.4 Forward voltage V Fig.1 Forward current vs. Forward voltage 10 1.0 0.1 0.1 1.0 Reverse voltage V Fig.3 Capacitance vs. Reverse voltage Rev.3.00 Dec 07, 2004 page -10 10 -11 10 -12 10 -13 10 0.6 0.8 1.0 (V) F Fig ...
Page 6
... HVC145 Fig.5 Forward resistance (parallel) vs. Forward voltage Rev.3.00 Dec 07, 2004 page f=100MHz 0.2 0.4 0.6 Forward voltage V (V) F 0.8 ...
Page 7
... HVC145 Package Dimensions Rev.3.00 Dec 07, 2004 page 1.2 ± 0.10 1.6 ± 0.10 Package Code JEDEC JEITA Mass (reference value January, 2003 Unit: mm UFP — Conforms 0.0016 g ...
Page 8
Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...