ECG012 WJ Communications, Inc., ECG012 Datasheet - Page 4

no-image

ECG012

Manufacturer Part Number
ECG012
Description
0.1 Watt, High Linearity Ingap Hbt Amplifier
Manufacturer
WJ Communications, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ECG012B-G
Manufacturer:
WJ
Quantity:
12 800
Part Number:
ECG012B-G
Manufacturer:
WJ
Quantity:
20 000
Part Number:
ECG012B-PCB1900
Manufacturer:
WJ
Quantity:
12 800
Part Number:
ECG012B-PCB1900
Manufacturer:
WJ
Quantity:
20 000
Part Number:
ECG012B-PCB2140
Manufacturer:
WJ
Quantity:
12 800
Part Number:
ECG012B-PCB2140
Manufacturer:
WJ
Quantity:
20 000
Part Number:
ECG012B-PCB900
Manufacturer:
WJ
Quantity:
12 800
Part Number:
ECG012B-PCB900
Manufacturer:
WJ
Quantity:
20 000
Part Number:
ECG012BTRG
Manufacturer:
WJ
Quantity:
12 800
Part Number:
ECG012BTRG
Manufacturer:
WJ
Quantity:
20 000
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
E012G
XXXX-X
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
ECG012B-G Mechanical Information
Specifications and information are subject to change without notice
The component will be marked with an
“E012G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E012”
alphanumeric lot code.
Tape and reel specification for this part is
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
ESD / MSL Information
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
Product Marking
designator
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
followed
Ensure that the ground /
Page 4 of 4 January 2008
by
an

Related parts for ECG012