APTM50H15UT1G Microsemi Corporation, APTM50H15UT1G Datasheet

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APTM50H15UT1G

Manufacturer Part Number
APTM50H15UT1G
Description
Full Bridge - Mosfet Full - Bridge Mosfet Power Module
Manufacturer
Microsemi Corporation
Datasheet
Absolute maximum ratings
Symbol
R
V
MOSFET Power Module
V
I
I
P
I
DSon
DM
AR
DSS
D
GS
D
5
7
Drain - Source Breakdown Voltage
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Pins 3/4 must be shorted together
11
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Full - Bridge
Q1
Q2
8
3
6
NTC
1
4
Parameter
10
Q3
Q4
12
2
9
www.microsemi.com
Application
Features
Benefits
V
R
I
D
T
T
T
DSS
DSon
c
c
c
= 25A @ Tc = 25°C
= 25°C
= 80°C
= 25°C
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Power MOS 8™ Ultrafast FREDFETs
Very low stray inductance
Internal thermistor for temperature monitoring
High level of integration
= 500V
-
-
-
-
-
-
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
Each leg can be easily paralleled to achieve a phase
leg of twice the current capability
RoHS Compliant
-
= 150mΩ typ @ Tj = 25°C
APTM50H15UT1G
Low R
Low input and Miller capacitance
Low gate charge
Ultrafast intrinsic reverse diode
Avalanche energy rated
Very rugged
Symmetrical design
Max ratings
DSon
500
135
±30
180
208
25
19
21
Unit
W
V
A
V
A
1 – 5

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APTM50H15UT1G Summary of contents

Page 1

... Drain - Source ON Resistance DSon P Maximum Power Dissipation D I Avalanche current (repetitive and non repetitive) AR These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com APTM50H15UT1G V = 500V DSS R = 150mΩ typ @ Tj = 25°C DSon I = 25A @ Tc = 25°C D Application • ...

Page 2

... Peak Diode Recovery t Reverse Recovery Time rr Q Reverse Recovery Charge rr dv/dt numbers reflect the limitations of the circuit rather than the device itself. ≤ - 21A di/dt ≤ 1000A/µ APTM50H15UT1G = 25°C unless otherwise specified j Test Conditions T = 25° 500V 125°C ...

Page 3

... 298.15 K 25/ ⎡ ⎢ exp B ⎣ SP1 Package outline (dimensions in mm) See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com APTM50H15UT1G To heatsink R T: Thermistor temperature 25 ⎤ ⎛ ⎞ Thermistor value ⎜ ⎜ ⎟ ⎟ − ...

Page 4

... Gate Charge vs Gate to Source =21A =25° =250V 120 Gate Charge (nC) APTM50H15UT1G Low Voltage Output Characteristics =125° 250µs pulse test @ < 0.5 duty cycle ...

Page 5

... Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. APTM50H15UT1G T =25° ...

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