EMP216 Excelics Semiconductor, EMP216 Datasheet
EMP216
Related parts for EMP216
EMP216 Summary of contents
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... V =3V VALUE - 4V Idss 3dB compression 175°C -65/175°C 22W Specifications are subject to change without notice. www.DataSheet4U.com EMP216 Dimension: 5330um X 3080um Thickness: 85um ± 15um =8V, I =1250mA MIN TYP MAX ±1.2 ...
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... P1dB P2dB Specifications are subject to change without notice. www.DataSheet4U.com EMP216 Gain over Temperature Frequency, GHz PAE at 1dB and 2dB gain compression PAE1dB PAE2dB Frequency, GHz Gain vs Vdd 1250mA ...
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... IM3 over temperature Pout=21.5dBm/tone -20 DB(|S(1,1)|) -40C DB(|S(2,2)|) -25 +25C +80C -30 -35 -40 -45 - Specifications are subject to change without notice. www.excelics.com www.DataSheet4U.com EMP216 Gain vs Iq, Vdd = 8V 1500mA 1250mA 1000mA Frequency, GHz Frequency, GHz 18 18 Page Revision 03 ...
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... GHz 2 Watt Power Amplifier MMIC Thickness: 85um ± 15um V DD .1uF .1uF 50pF Cap, x12 Stand-off, x4 .1uF .1uF V DD Specifications are subject to change without notice. www.excelics.com www.DataSheet4U.com EMP216 2916 1714 1372 649 164 Gold plated ridge OUT Page Revision 03 ...
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... To obtain full performance, RF input and output bond wires should be as short as possible. Wire length should be 7 mils maximum, with at least two wires per pad. Mounting the EMP216 on a “ridge” or pedestal is recommended to align the top surface of the MMIC to the interfacing substrate and minimize bond wire length. ...