US1881 Melexis Microelectronic Systems, US1881 Datasheet - Page 8

• Manufacturer Part Number: US1881
• Description: CMOS MULTI-PURPOSE LATCH
• Manufacturer: Melexis Microelectronic Systems

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12 Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture
sensitivity level, as defined in this specification, according to following test methods:
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, European legislation (Directive on the
Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has
installed a Roadmap to qualify their package families for lead free processes also.
Various lead free generic qualifications are running, current results on request.
For more information on Melexis lead free statement see quality page at our website:
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf
13 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901001881
Rev. 014
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
Resistance to soldering temperature for through-hole mounted devices
Resistance to soldering temperature for through-hole mounted devices
Solderability
IPC/JEDEC J-STD-020
EIA/JEDEC JESD22-A113
CECC00802
EIA/JEDEC JESD22-B106
EN60749-15
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Page 8 of 11
US1881
Jun/05