APL5910 Anpec Electronics Coropration, APL5910 Datasheet - Page 12

• Manufacturer Part Number: APL5910
• Description: 1A, Ultra Low Dropout (0.12v Typical) Linear Regulator
• Manufacturer: Anpec Electronics Coropration

APL5910
Layout Consideration (See figure 1)
1. Please solder the Exposed Pad on the system ground
2. Please place the input capacitors for VIN and VCNTL
3. Ceramic decoupling capacitors for load must be
4. To place APL5910 and output capacitors near the load
5. The negative pins of the input and output capacitors
6. Large current paths, shown by bold lines on the fig-
7. Place the R1, R2, and C1 near the APL5910 as close
8. Connect the ground of the R2 to the GND pin by using
9. Connect the one pin of the R1 to the load for Kelvin
10. Connect one pin of the C1 to the VOUT pin for reliable
Copyright
Rev. A.2 - Aug., 2008
pad on the top-layer of PCBs. The ground pad must
have wide size to conduct heat into the ambient air
through the system ground plane and PCB as a heat
sink.
pins near the pins as close as possible for decoupling
high-frequency ripples.
placed near the load as close as possible for
decoupling high-frequency ripples.
reduces parasitic resistance and inductance for ex-
cellent load transient reponse.
and the GND pin must be connected to the ground
plane of the load.
ure 1, must have wide tracks.
as possible to avoid noise coupling.
a dedicated track.
sensing.
feedback compensation.
C
CNTL
VCNTL
APL5910
GND
ANPEC Electronics Corp.
VOUT
VIN
FB
(Optional)
V
CNTL
C1
R2
Figure 1
C
R1
OUT
C
IN
Load
V
V
OUT
IN
12
Thermal Consideration
Refer to the figure 2, the SOP-8P is a cost-effective pack-
age featuring a small size like a standard SOP-8 and a
bottom exposed pad to minimize the thermal resistance
of the package, being applicable to high current
applications. The exposed pad must be soldered to the
top-layer ground plane. It is recommended to connect the
top-layer ground pad to the internal ground plan by using
vias. The copper of the ground plane on the top-layer con-
ducts heat into the PCB and ambient air. Please enlarge
the area of the top-layer pad and the ground plane to
reduce the case-to-ambient resistance (
Recommanded Minimum Footprint
Ambient
Internal
ground
plane
Air
8
1
0.050
1
2
3
4
7
2
Figure 2
0.138
SOP-8P
Die
6
3
Unit : Inch
Exposed
Pad
0.024
7
6
5
8
5
4
www.anpec.com.tw
PCB
ground
plane
CA
Top
).