MC74ACT541DTG ON Semiconductor, MC74ACT541DTG Datasheet - Page 11

• Manufacturer Part Number: MC74ACT541DTG
• Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
• Manufacturer: ON Semiconductor
• Series: 74ACTr

Specifications of MC74ACT541DTG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Logic Family: 74ACT
• Number Of Channels Per Chip: Octal
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 24 mA
• Input Bias Current (max): 8 uA
• Low Level Output Current: 24 mA
• Maximum Power Dissipation: 200 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 3
• Output Type: 3-State
• Propagation Delay Time: 7.5 ns @ 5 V
• Logic Device Type: Buffer/Line Driver, Non Inverting
• Supply Voltage Range: 4.5V To 5.5V
• Logic Case Style: TSSOP
• No. Of Pins: 20
• Operating Temperature Range: -40°C To +85°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: ACT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74ACT541DTGOS

0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
20
1
D
0.36
16X
20X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−V−
0.10 (0.004)
A
K
REF
G
H
M
11
10
PACKAGE DIMENSIONS
T
SOLDERING FOOTPRINT*
1
1.26
16X
U
−U−
http://onsemi.com
S
B
CASE 948E−02
DT SUFFIX
V
TSSOP−20
ISSUE C
S
7.06
11
N
J J1
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
F
0.25 (0.010)
DIMENSIONS: MILLIMETERS
K1
K
M
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION:
3. DIMENSION A DOES NOT INCLUDE
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
MILLIMETER.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
J1
K1
M
A
B
C
D
F
G
H
K
L
J
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
−−−
0
0.026 BSC
0.252 BSC
_
INCHES
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_