PA45DIE Apex Microtechnology Corporation, PA45DIE Datasheet

PA45DIE

Manufacturer Part Number

PA45DIE

Description

High Voltage Power op Amp

Manufacturer

Apex Microtechnology Corporation

Datasheet

1.PA45DIE.pdf (1 pages)

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ABSOLUTE MAXIMUM RATINGS

NOTE: Because of wafer probing test limitations, full power tests are not possible. Refer to parent

DC WAFER PROBED SPECIFICATIONS

PARAMETER

OFFSET VOLTAGE, initial

OFFSET VOLTAGE, vs. supply

BIAS CURRENT, initial

OFFSET CURRENT, initial

SUPPLY CURRENT, quiescent

COMMON MODE REJECTION

VOLTAGE SWING, positive

VOLTAGE SWING, negative

ALARM, sink current

ALARM, leakage

NOTES: 1. Current limit, I

DIE

LAYOUT

Thickness: 11 Mil (280µ)

Backside: Silicon (no back metal)

Small Bond pads: 5 Mil sq (127µ) AI

Large Bond pads: 5 x 11 Mil (127µ x 280µ) AI

NOTE: Tie backside to –V

M I C R O T E C H N O L O G Y

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.

product data sheet PA45 for typical AC, DC and power performance specifications.

ommended die attach material is either conductive

epoxy or silver-glass. Lowest thermal resistance will

be obtained with silver-glass.

220 Mil

5588µ

pin, and shutdown verified as operational.

through die attach medium. Rec-

H T T P : / / W W W . A P E X M I C R O T E C H . C O M

NO LONGER SUPPORTED FOR DESIGN-IN

220 Mil

5588µ

TEST CONDITIONS

HIGH VOLTAGE POWER OPERATIONAL AMPLIFIER

= ±20V to ±75 V

= ±20V

= ±50V, I

= ±20V to ±75 V

= ±45V, V

SUPPLY VOLTAGE, +V

OUTPUT CURRENT, continuous

INPUT VOLTAGE, differential

INPUT VOLTAGE, common mode

TEMPERATURE, junction

= 40mA

= –40mA

= ±75V

PA45DIE

Recommended wire is 2 mil aluminum. All large bond pads

must be used to avoid excessive current density in the die

metalization.

Pad

6-10

* Pad 3 (Alarm) is tied to a switched current source. When an

over-temperature condition exits the current source turns on

and sinks 90µA to –V

output stage when at least 90µA is pulled from pad 4 to any

voltage at least 3 volts less positive than +V

example). When pad 3 is tied to pad 4 an over-temperature

condition will shut off the output stage until power is cycled

and the fault is removed. Normally pad 22 (I

When pad 22 is tied to pad 23 the quiescent current in the

output stage is disabled. The result is lower quiescent but

class C biasing of the output stage.

CAUTION

to –V

Function

– Input

+ Input

Alarm

Shutdown

–V

( 8 0 0 ) 5 4 6 - A P E X

MIN

–40

PA45DIE is a MOSFET amplifier. ESD handling

procedures must be observed.

. Pad 4 (Shutdown) will shut off the

Pad

11-16

17-21

22*

150V

±16V

±V

150°C

MAX

( 8 0 0 ) 5 4 6 - 2 7 3 9

Function

Output Drive

Compensation

Current Limit Sense

UNITS

) is left open.

µV/V

µA

(ground, for

219

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