BY228AMO Philips Semiconductors (Acquired by NXP), BY228AMO Datasheet - Page 3

• Manufacturer Part Number: BY228AMO
• Description: BY228; Damper Diode;; Package: SOD64
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.4.
1996 Sep 26
R
R
SYMBOL
th j-tp
th j-a
Damper diode
For more information please refer to the “General Part of associated Handbook” .
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
PARAMETER
3
lead length = 10 mm
note 1
mounted as shown in Fig.5
CONDITIONS
Product specification
VALUE
25
75
40
BY228
UNIT
K/W
K/W
K/W