FAN3850T Fairchild Semiconductor, FAN3850T Datasheet - Page 10

• Manufacturer Part Number: FAN3850T
• Description: Microphone Pre-Amplifier
• Manufacturer: Fairchild Semiconductor

© 2011 Fairchild Semiconductor Corporation
FAN3850T • Rev. 3.0.0
Physical Dimensions
Table 1.
Ball Composition: SN97.5-Ag2.5
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
PIN A1
AREA
2X
1.260mm
0.01 C
Product-Specific Dimensions
C
0.485
D
0.03 C
0.570
BOTTOM VIEW
TOP VIEW
1
E
2
Figure 10. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
PLANE
SEATING
C
B
A
(X) +/-0.018
A
Ø0.120±0.010
6X
0.300
0.254
0.005
D
D
B
0.860mm
0.06 C
F
2X
(Y) +/-0.018
E
E
F
0.03 C
C A B
SIDE VIEWS
10
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
D. DATUM C, THE SEATING PLANE IS DEFINED
E. PACKAGE TYPICAL HEIGHT IS 273 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
G. DRAWING FILENAME: UC006AHrev3.
A. NO JEDEC REGISTRATION APPLIES.
ASME Y14.5M, 1994.
BY THE SPHERICAL CROWNS OF THE BALLS.
±23 MICRONS (254-300 MICRONS).
PRODUCT DATASHEET.
0.145mm
X
0.485
RECOMMENDED LAND
PATTERN (NSMD)
A1
0.570
0.197±0.013
(Ø0.120)
CU PAD
0.080±0.010
(Ø0.220)
SOLDER MASK
0.145mm
Y
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