SMAJ550 General Semiconductor, SMAJ550 Datasheet - Page 2

• Manufacturer Part Number: SMAJ550
• Description: SURFACE MOUNT TRANSZORB TRANSIENT VOLTAGE SUPPRESSOR
• Manufacturer: General Semiconductor

The pad dimensions should be 0.010” (2.5mm) longer than the
contact size in the lead axis. This allows a solder fillet to form, see
figure below. Contact factory for soldering methods.
MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMAJ530 AND SMAJ550
100
1.0
0.1
10
0.1 s
RECOMMENDED PAD LAYOUT
150
100
50
0
0
0.050 MIN
(1.27 MIN)
Dimensions in inches and (millimeters )
0.060 MIN
(1.52 MIN)
FIG. 1 - PEAK PULSE POWER RATING CURVE
td
1.0 s
tr=10 sec.
MODIFIED J-BEND
1.0
FIG. 3 - PULSE WAVEFORM
PEAK VALUE
I
PPM
td, PULSE WIDTH, sec.
0.220 REF
(5.58)
10 s
t, TIME, ms
HALF VALUE - I
PULSE WIDTH (td) is DEFINED
as the POINT WHERE the PEAK
CURRENT DECAYS
to 50% of I
2.0
0.094 MAX
(2.38 MAX)
10/1000 sec. WAVEFORM
as DEFINED by R.E.A.
100 s
PPM
PPM
2
NON-REPETITIVE
PULSE WAVEFORM
SHOWN in FIG. 3
T
A
3.0
=25°C
APPLICATION NOTES
1.0ms
4.0
10ms
Respect Thermal Resistance (PCB Layout) - as the temperature coefficient also
Select minimum breakdown voltage, so you get acceptable power dissipation and
Clamping voltage is influenced by internal resistance - design approximation is
Keep temperature of TVS lower than TOPSwitch as a recommendation.
Maximum current is determined by the maximum T
Minimum breakdown voltage can be customized for other applications.
contributes to the clamping voltage.
PCB tie point temperature. Devices with higher breakdown voltage will have a
shorter conduction time and will dissipate less power.
7V per 100mA slope.
300mA. Contact supplier for different clamping voltage / current arrangements.
Contact supplier.
10,000
1,000
100
75
50
25
0
0
25
FIG. 2 - PULSE DERATING CURVE
T
A
50
, AMBIENT TEMPERATURE, °C
75
100
125
J
and can be higher than
150
175