LM136-25 National Semiconductor, LM136-25 Datasheet - Page 3

• Manufacturer Part Number: LM136-25
• Description: Reference Diode
• Manufacturer: National Semiconductor

Reverse Breakdown Voltage
Reverse Breakdown Change
With Current
Reverse Dynamic Impedance
Temperature Stability
(Note 4)
Reverse Breakdown Change
With Current
Reverse Dynamic Impedance
Long Term Stability
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its specified operating conditions.
Note 2: For elevated temperature operation, T
Note 3: Unless otherwise specified, the LM136-2.5 is specified from −55˚C
Note 4: Temperature stability for the LM336 and LM236 family is guaranteed by design. Design limits are guaranteed (but not 100% production tested) over the in-
dicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Stability is defined as the maximum change in V
25˚C to T
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Reverse Current
Forward Current
Storage Temperature
Electrical Characteristics
LM136
LM236
LM336
T
ja
ja
A
(Junction to Ambient)
(Junction to Case)
Thermal Resistance
+70˚C.
Parameter
A
(min) or T
150˚C
125˚C
100˚C
A
(max).
T
LM136, LM236, LM336
LM136A, LM236A, LM336B
T
400 µA I
T
V
I
0˚C T
−25˚C T
−25˚C
−55˚C T
400 µA I
I
T
t = 1000 hrs
R
R
A
A
A
R
A
= 1 mA, Figure 2
= 1 mA
(LM236H, LM236Z)
= 25˚C, I
= 25˚C,
= 25˚C, I
= 25˚C
Adjusted to 2.490V
A
j
170˚C/W (0.125" lead)
180˚C/W (0.4" leads)
max is:
70˚C (LM336)
A
A
T
R
R
±
A
R
R
+85˚C
+125˚C (LM136)
Conditions
0.1˚C, I
10 mA
10 mA
= 1 mA
= 1 mA, f = 100 Hz
(Note 3)
−60˚C to +150˚C
+85˚C (LM236M)
TO-92
n/a
(Note 1)
R
= 1 mA,
15 mA
10 mA
T
A
3
440˚C/W
+125˚C, the LM236-2.5 from −25˚C
80˚C/W
TO-46
Soldering Information
Operating Temperature Range (Note 2)
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” (Appendix D) for other methods of
soldering surface mount devices.
LM136A-2.5/LM236A-2.5
2.440
2.465
LM136
LM236
LM336
TO-92 Package (10 sec.)
TO-46 Package (10 sec.)
SO Package
LM136-2.5/LM236-2.5
Min
Vapor Phase (60 sec.)
Infrared (15 sec.)
165˚C/W
SO-8
2.490
2.490
n/a
Typ
2.6
0.2
3.5
7.5
0.4
12
20
3
2.540
2.515
Max
0.6
18
18
10
6
9
1
T
A
2.390
2.440
Min
+85˚C and the LM336-2.5 from 0˚C
LM336B-2.5
LM336-2.5
2.490
2.490
Typ
2.6
0.2
1.8
0.4
20
3
−55˚C to +150˚C
−25˚C to +85˚C
0˚C to +70˚C
2.590
2.540
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Max
1.4
10
12
1
6
ref
260˚C
300˚C
215˚C
220˚C
Units
from
ppm
mV
mV
mV
mV
mV
mV
V
V