MCP73833 Microchip Technology, Inc., MCP73833 Datasheet - Page 20

• Manufacturer Part Number: MCP73833
• Description: 1A output current linear charge management controller. Includes integrated pass transistor, integrated current sensing, and reverse discharge protection. Also includes safety features such as cell temperature monitoring, on-chip thermal regulation an
• Manufacturer: Microchip Technology, Inc.

MCP73833/4
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
DS22005A-page 20
B
c
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dime n sion, usually witho ut tolerance, for information purposes only.
JEDEC Equivalent: MO-187 BA
Drawing No. C04-021
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bott om
p
See ASME Y14.5M
See ASME Y14.5M
n
β
Dimension Limits
E1
E
Units
A2
A1
E1
E
D
F
φ
B
α
n
p
A
L
c
β
MIN
(F)
.030
.000
.016
.003
.006
L
0°
5°
5°
2
1
.020 BSC
.193 BSC
.118 BSC
.118 BSC
.037 REF
Note:
INCHES
NOM
D
.033
.024
.009
φ
10
–
–
–
–
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MAX
A1
A
.043
.037
.006
.031
.009
.012
15°
15°
8°
MIN
0.75
0.00
0.40
0.08
0.15
0°
5°
5°
MILLIMETERS*
–
0.50 BSC
4.90 BSC
3.00 BSC
3.00 BSC
Revised 09-16-05
0.95 REF
© 2006 Microchip Technology Inc.
NOM
0.85
0.60
0.23
10
–
–
–
–
–
MAX
1.10
0.95
0.15
0.80
0.23
0.30
15°
15°
A2
8°
α