MAX13331 Maxim Integrated Products, MAX13331 Datasheet - Page 2

• Manufacturer Part Number: MAX13331
• Description: (MAX13330 / MAX13331) Automotive DirectDrive Headphone Amplifiers
• Manufacturer: Maxim Integrated Products

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Automotive DirectDrive Headphone Amplifiers
with Output Protection and Diagnostics
ABSOLUTE MAXIMUM RATINGS
V
V
V
V
SHDN, DIAG to SGND................................-0.3V to (V
OUT_ to PGND.......................................(V
IN_ to SGND (MAX13330)................(V
IN_ to SGND (MAX13331) ..........................-0.3V to (V
C1P to PGND.........................................-0.3V to (V
C1N to PGND.............................................(V
Output Short-Circuit Duration.....................................Continuous
ELECTRICAL CHARACTERISTICS
(V
MAX13330 gain = -1.5V/V (internally set), for MAX13331 gain = -1.5V/V (R
otherwise noted. Typical values are at T
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
GENERAL
Amplifier Supply Voltage Range
Charge-Pump Supply Voltage
Range
Charge-Pump Output Voltage
Quiescent Supply Current
Shutdown Supply Current
SHDN Input-Logic High
SHDN Input-Logic Low
SHDN Input Leakage Current
SHDN to Full Operation Time
DIAGNOSTICS
Diagnostic Output Voltage
Short-to-SGND Threshold
Short-to-V
DD
SS
DD
SS
DD
, CPVSS to SGND ...............................................+0.3V to -6V
, CPVSS..............................................................-0.3V to 0.3V
, CPVDD to SGND..............................................-0.3V to +6V
, CPVDD ............................................................-0.3V to 0.3V
_______________________________________________________________________________________
= V
layer board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.
CPVDD
PARAMETER
BAT
Threshold
= +5V, V
SGND
= V
PGND
SYMBOL
SS
V
V
I
V
A
CPVDD
CPVSS
SHDN
t
V
I
SON
V
DIAG
- 0.3V) to (V
V
DD
= +25°C, unless otherwise noted.) (Note 2)
DD
CPVSS
IH
IL
= 0, SHDN = V
SS
- 0.3V) to + 0.3V
- 0.3V) to +45V
CPVDD
R
R
T
A
L
DIAG
DD
DD
DD
= ∞
= +25°C
+ 0.3V)
+ 0.3V)
+ 0.3V)
= ∞,
+0.3V)
DD
, C1 = C2 = 1µF, R
CONDITIONS
Continuous Power Dissipation (T
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
16-Pin QSOP (derate 8.3mW/°C above +70°C)) ......666.7mW
θ
θ
JC
JA
IN
No fault
OUTR short to
SGND
OUTL short to
SGND
OUTR short to
V
OUTL short to
V
............................................................................... 37°C/W
............................................................................. 120°C/W
= 30kΩ, R
BAT
BAT
L
= ∞, resistive load referenced to ground, for
FB
= 45kΩ), T
0.22 x
0.47 x
0.72 x
0.97 x
MIN
V
V
V
V
130
130
4.0
4.0
-1
DD
DD
DD
DD
2
A
A
= T
= +70°C)
J
0.25 x
0.50 x
0.75 x
-V
TYP
V
V
V
= -40°C to +105°C, unless
100
10
DD
DD
DD
DD
JC
) (Note 1)
JA
) (Note 1)
0.02 x
0.28 x
0.53 x
0.78 x
MAX
V
V
V
V
5.5
5.5
0.8
10
+1
DD
DD
DD
DD
UNITS
mA
mA
mA
µA
µA
µs
V
V
V
V
V
V