TEA6200 Philips Semiconductors (Acquired by NXP), TEA6200 Datasheet - Page 12

• Manufacturer Part Number: TEA6200
• Description: Integrated am Upconversion Receiver
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
PACKAGE OUTLINE
August 1989
DIP20: plastic dual in-line package; 20 leads (300 mil)
Integrated AM upconversion receiver
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
SOT146-1
L
OUTLINE
VERSION
max.
Z
0.17
4.2
A
20
1
pin 1 index
0.020
min.
0.51
A
1
IEC
max.
0.13
3.2
A
2
0.068
0.051
1.73
1.30
b
e
0.021
0.015
0.53
0.38
JEDEC
b
D
1
REFERENCES
0
0.014
0.009
0.36
0.23
c
b
26.92
26.54
1.060
1.045
D
(1)
SC603
scale
EIAJ
12
5
6.40
6.22
0.25
0.24
E
(1)
2.54
0.10
11
10
b
e
1
10 mm
7.62
0.30
w
A
e
1
1
M
A
E
2
3.60
3.05
0.14
0.12
L
A
PROJECTION
EUROPEAN
8.25
7.80
0.32
0.31
M
E
c
10.0
0.39
0.33
M
8.3
Product specification
H
(e )
M
M
1
H
E
TEA6200
ISSUE DATE
0.254
0.01
92-11-17
95-05-24
w
SOT146-1
max.
0.078
2.0
Z
(1)