FT230XQ-R International Semiconductor Technologies, FT230XQ-R Datasheet - Page 39

• Manufacturer Part Number: FT230XQ-R
• Description: Specifications: Number of Channels: 1, UART ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant
• Manufacturer: International Semiconductor Technologies

9.5 Solder Reflow Profile
The FT230X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
Figure 9.5 FT230X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT230X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT230X is used with non-Pb free solder).
Table 9.1 Reflow Profile Parameter Values
25
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
T = 25º C to T
Preheat
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Time, t (seconds)
Min to t
(t
T
t
L
p
S
:
)
L
)
s
P
Max)
s
s
L
)
Min.)
Max.)
Ramp Up
s
p
)
to T
p
)
p
Pb Free Solder Process
t
p
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
t
L
150°C
200°C
217°C
260°C
Document No.: FT_000566 Clearance No.: FTDI# 260
Ramp
Down
FT230X USB TO BASIC UART IC
Critical Zone: when
T is in the range
T to T
L
p
Non-Pb Free Solder Process
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
Version 1.2
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