MAX3736 Maxim Integrated Products, MAX3736 Datasheet - Page 10

• Manufacturer Part Number: MAX3736
• Description: SFP Laser Driver
• Manufacturer: Maxim Integrated Products

The exposed pad on the 16-pin QFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3736
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note HFAN-08.1: Thermal
Considerations for QFN and Other Exposed-Pad
Packages for additional information.
Using the MAX3736 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Customers must determine the level of
fault tolerance required by their application. Please rec-
ognize that Maxim products are not designed or autho-
rized for use as components in systems intended for
surgical implant into the body, for applications intended
to support or sustain life, or for any other application
where the failure of a Maxim product could create a situ-
ation where personal injury or death may occur.
The origin for pad coordinates is defined as the bottom
left corner of the bottom left pad. All pad locations are
referenced from the origin, and indicate the center of
the pad where the bond wire should be connected.
Refer to Maxim Application Note HFAN-08.0.1:
Understanding Bonding Coordinates and Physical Die
Size for detailed information.
TRANSISTOR COUNT: 1385
PROCESS: SiGe BIPOLAR
SUBSTRATE CONNECTED TO GND
DIE THICKNESS: 15 mils
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
10
______________________________________________________________________________________
Laser Safety and IEC 825
Exposed-Pad Package
Pad Configuration
Chip Topography/
TOP VIEW
(0,0)
V
V
IN+
IN-
CC
CC
V
V
IN+
IN-
THE EXPOSED PAD MUST BE CONNECTED TO GROUND
FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE
CC
CC
1
2
3
4
GND
BIASSET
THIN QFN (3mm x 3mm)
DIS
16
5
MODSET
V
1.55mm
(61mils)
CC
15
6
MA3736
GND GND GND
BC_MON
Pin Configuration
Chip Topography
14
7
www.DataSheet4U.com
BIAS
13
8
12
11
10
9
V
OUT-
OUT-
OUT+
OUT+
V
CC
CC
V
OUT-
OUT+
V
CC
CC
1.14mm
(45mils)