MAX4684-MAX4685 Maxim, MAX4684-MAX4685 Datasheet - Page 2

• Manufacturer Part Number: MAX4684-MAX4685
• Description: 0.5 /0.8 Low-Voltage / Dual SPDT Analog Switches in UCSP
• Manufacturer: Maxim

ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND)
V+, IN_......................................................................-0.3V to +6V
COM_, NO_, NC_ (Note1) ........................... -0.3V to (V+ + 0.3V)
Continuous Current NO_, NC_, COM_ .......................... ±300mA
Peak Current NO_, NC_, COM_
Peak Current NO_, NC_, COM_
ELECTRICAL CHARACTERISTICS—+3V SUPPLY
(V+ = +2.7V to +3.3V, V
(Notes 3, 9, 10)
0.5 Ω /0.8 Ω Low-Voltage, Dual SPDT
Analog Switches in UCSP
Note 1: Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
(pulsed at 1ms, 50% duty cycle).................................±400mA
(pulsed at 1ms, 10% duty cycle).................................±500mA
ANALOG SWITCH
Analog Signal Range
NC_ On-Resistance
(Note 4)
NO_ On-Resistance
(Note 4)
On-Resistance Match
Between Channels
(Notes 4, 5)
NC_ On-Resistance
Flatness (Note 6)
NO_ On-Resistance
Flatness (Note 6)
NO_ or NC_ Off-
Leakage Current
(Note 7)
COM_ On-Leakage
Current (Note 7)
DYNAMIC CHARACTERISTICS
Turn-On Time
_______________________________________________________________________________________
PARAMETER
maximum current rating.
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-
heating is required. Hand or wave soldering is not allowed.
IH
= +1.4V, V
V
I
NO
I
R
R
I
NO
COM
SYMBOL
NC
R
R
FLAT (NO)
FLAT (NC)
V
ON(NC)
ON(NO)
_(OFF) or
COM
_, V
_(OFF)
t
R
ON
_(ON)
ON
NC
_
IL
_,
= +0.5V, T
V
V
V
V
V
fl oati ng ; V
V + = 2.7V ; I
V
V+ = 2.7V; I
V+ = 2.7V; I
V + = 2.7V ; I
V+ = 2.7V; I
V+ = 3.3V; V
V + = 3.3V ; V
V+ = 2.7V, V
R
N C
NO
NO
NO
COM
NC
L
= 50 ; C
_ = 0 to V +
_ = 0 to V+
_ or V
_ = 0 to V+
_ = 0 to V+
_ = 0.3V, 3V
A
= T
NC
C OM
C OM
C OM
COM
MIN
COM
COM
_ = 1.5V
CONDITIONS
N O
L
NO
NO
_ = 3V , 0.3V , or fl oati ng
= 35pF; Figure 2
_ = 100mA;
_ or V
= 100mA;
_ or V
_ or V
to T
_ = 100mA;
_ = 100mA;
= 100mA;
MAX
N C
NC
NC
_ = 3V , 0.3V , or
, unless otherwise noted. Typical values are at +3V and +25°C.)
_ = 3V, 0.3V;
_ = 1.5V;
Continuous Power Dissipation (T
Operating Temperature Ranges..........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 2)
12-Bump UCSP (derate 11.4mW/°C above +70°C) ...909mW
10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW
Infared (15s)................................................................+220°C
Vapor Phase (60s) ......................................................+215°C
MAX4684
MAX4685
MAX4684
MAX4685
+25 C
+25 C
+25 C
+25 C
+25 C
+25 C
+25 C
T
E
E
E
E
E
E
E
E
E
E
E
A
MIN
-10
-20
-1
-2
0
A
= +70°C)
TYP
0.45
0.45
0.3
30
MAX
0.06
0.06
0.15
0.35
0.35
0.5
0.5
0.8
0.8
0.8
0.8
V+
10
20
50
60
1
2
UNITS
nA
nA
ns
V