ADA4410-6 Analog Devices, ADA4410-6 Datasheet - Page 7

• Manufacturer Part Number: ADA4410-6
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature
Operating Temperature Range
Lead Temperature Range (Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for a device soldered in the circuit board with its
exposed paddle soldered to a pad on the PCB surface that is
thermally connected to a copper plane.
Table 4. Thermal Resistance
Package Type
5 mm × 5 mm, 32-Lead LFCSP
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4410-6
package is limited by the associated rise in junction temperature
(T
transition temperature, the plastic changes its properties.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, permanently
shifting the parametric performance of the ADA4410-6.
Exceeding a junction temperature of 150°C for an extended
period of time can result in changes in the silicon devices
potentially causing failure.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
JA
J
) on the die. At approximately 150°C, which is the glass
is specified for the worst-case conditions, that is, θ
θ
43
JA
Rating
12 V
See Figure 2
–65°C to +125°C
–40°C to +85°C
300°C
150°C
θ
5.1
JC
JA
is
Unit
°C/W
Rev. 0 | Page 7 of 16
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
depends upon the particular application. For each output, the
power due to load drive is calculated by multiplying the load
current by the associated voltage drop across the device. The
power dissipated due to all of the loads is equal to the sum of
the power dissipations due to each individual load. RMS
voltages and currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
Also, more metal directly in contact with the package leads
from metal traces, through-holes, ground, and power planes
reduces the θ
package must be soldered to a pad on the PCB surface that is
thermally connected to a copper plane in order to achieve the
specified θ
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 32-lead LFCSP
(43°C/W) on a JEDEC standard 4-layer board with the
underside paddle soldered to a pad that is thermally connected
to a PCB plane. θ
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
–40
JA
.
JA
. The exposed paddle on the underside of the
–20
JA
values are approximations.
S
). The power dissipated due to load drive
AMBIENT TEMPERATURE (°C)
0
20
LFCSP
D
40
) is the sum of the
ADA4410-6
60
S
) times the
80
JA
.