AT91FR4042 ATMEL Corporation, AT91FR4042 Datasheet - Page 20

• Manufacturer Part Number: AT91FR4042
• Description: The AT91FR4042 Features 256K Bytes of On-chip SRAM, 512K Bytes of Flash, an External Bus Interface, a 3-channel Timer/Counter, 2 Usarts, a Watchdog Timer And Advanced Power-saving Features.
• Manufacturer: ATMEL Corporation

Soldering Profile
20
AT91FR4042
Preliminary
Table 7 gives the recommended soldering profile from J-STD-20.
Table 7. Soldering Profile
Small packages may be subject to higher temperatures if they are reflowed in boards
with larger components. In this case, small packages may have to withstand tempera-
tures of up to 235 C, not 220 C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume.
See Table 8.
Table 8. Recommended Package Reflow Conditions
Notes:
A maximum of three reflow passes is allowed per component.
Average Ramp-up Rate (183 C to Peak)
Preheat Temperature 125 C ±25 C
Temperature Maintained Above 183 C
Time within 5 C of Actual Peak
Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
Parameter
Convection
VPR
IR/Convection
1. The packages are qualified by Atmel by using IR reflow conditions, not convection or
2. By default, the package level 1 is qualified at 220 C (unless 235 C is stipulated).
3. The body temperature is the most important parameter but other profile parameters
VPR.
such as total exposure time to hot temperature or heating rate may also influence
component reliability.
220 +5/-0 C or
Convection or
IR/Convection
3 C/sec. max.
120 sec. max
60 sec. to 150 sec.
10 sec. to 20 sec.
235 +5/-0 C
6 C/sec.
6 min. max
Temperature
220 +5/-0 C
215 to 219 C
220 +5/-0 C
(1, 2, 3)
VPR
10 C/sec.
60 sec.
215 to 219 C or
235 +5/-0 C
10 C/sec.
2648B–ATARM–12/02