ATJ2085 ETC, ATJ2085 Datasheet - Page 32

• Manufacturer Part Number: ATJ2085
• Description: Atj2085 is a Single-chip for Flash-based Digital Music Player
• Manufacturer: ETC

ATJ2085
7. Recommended Soldering Conditions
Note: Maximum number of days during which the product can be stored at the temperature of 25
Caution: Do not apply two or more different soldering methods to one chip (except for partial heating
Partial heating method
Copyright © 2004 Actions Semiconductor Co., Ltd. All rights reserved.
7.2 Precaution against ESD for Semiconductors
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators
that easily build static electricity. Semiconductor devices must be stored and transported in an
anti-static container, static shielding bag or conductive material. All test and measurement tools
including work bench and floor should be grounded. The operator should be grounded using wrist
strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be
taken for PW boards with semiconductor devices on it.
7.3 Handling of Unused Input Pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to
Infrared ray reflow
Soldering Conditions for Surface-Mount Devices
Soldering Process
7.1 Soldering Conditions
VER 1.5
relative humidity of 65% or less after dry-pack package is opened.
method for terminal sections).
Soldering Conditions
Peak package’s surface temperature: 235℃
Reflow time: 30 seconds or less (210 or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days (10 hours of pre-baking is required at 125
Terminal temperature: 300
Heat time: 3 seconds or less (for one side of a device)
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Page 31
DATA SHEET
℃
or less
℃
8/18/2004
Actions
℃
afterward).
℃
and