MAX8521 Maxim Integrated Products, MAX8521 Datasheet - Page 2

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MAX8521

Manufacturer Part Number
MAX8521
Description
Smallest TEC Power Drivers
Manufacturer
Maxim Integrated Products
Datasheet

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ABSOLUTE MAXIMUM RATINGS
V
SHDN, MAXV, MAXIP, MAXIN,
COMP, FREQ, OS1, OS2, CS, REF,
PV
PV
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC short to GND....................................Indefinite
LX Current (Note 1) ........................................±2.25A LX Current
ELECTRICAL CHARACTERISTICS
(V
T
Smallest TEC Power Drivers for Optical
Modules
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to
Note 2: Solders underside metal slug to PCB ground plane.
2
Input Supply Range
Maximum TEC Current
Reference Voltage
Reference Load Regulation
MAXIP/MAXIN Threshold
Accuracy
NFET On-Resistance
PFET On-Resistance
NFET Leakage
PFET Leakage
No-Load Supply Current
Shutdown Supply Current
Thermal Shutdown
UVLO Threshold
DD
A
DD
CTLI to GND .........................................................-0.3V to +6V
ITEC to GND...........................................-0.3V to (V
DD
DD
= 0°C to +85°C, unless otherwise noted. Typical values at T
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
1, PV
1, PV
= V
exceed the IC’s package power dissipation limits.
PVDD1
DD
DD
PARAMETER
2 to GND...............................-0.3V to (V
2 to V
= V
DD
PVDD2
...........................................-0.3V to +0.3V
= V
SHDN
= 5V, 1MHz mode (Note 3). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,
T
R
R
SHUTDOWN
SYMBOL
I
I
DS(ON-N)
DS(ON-P)
LEAK(N)
LEAK(P)
I
I
V
∆V
LOAD)
DD(NO
DD-SD
V
V
UVLO
REF
DD
REF
V
V
V
V
V
V
V
V
V
V
V
V
V
1.500V, V
V
1.500V, V
SHDN = GND, V
Hysteresis = 15°C
V
V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
LX
LX
LX
LX
COMP
COMP
DD
DD
= V
= V
= 0, T
= 0, T
+ 0.3V)
+ 0.3V)
= 3V to 5.5V, I
= 3V to 5V, I
= 5V
= 3V
= 5V, I = 0.2A
= 3V, I = 0.2A
= 5V, I = 0.2A
= 3V, I = 0.2A
rising
falling
DD
DD
= V
= V
DD
DD
A
A
A
= 5V, T
= 5V T
REF
REF
= +25°C
= +85°C
= +25°C.)
= 5V
= 3.3V
CONDITIONS
=
=
DD
REF
A
Continuous Power Dissipation (T
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
A
REF
= +85°C
= 5V, (Note 4)
= +25°C
6 x 6 UCSP (derate 22mW/°C above +70°C) ...............1.75W
20-Pin 5mm x 5mm x 0.9mm TQFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
36-Bump WLP (derate 22mW/°C above +70°C)............1.75W
= 10µA to 1mA
V
V
V
V
500kHz mode
1MHz mode
500kHz mode
1MHz mode
= 150µA
MAXI_
MAXI_
MAXI_
MAXI_
= V
= V
= V
= V
REF
REF
REF
REF
/3
/3
1.485
MIN
±1.5
2.50
2.40
140
143
3.0
40
45
A
= +70°C)
1.500
+165
TYP
0.09
0.11
0.14
0.17
0.03
0.03
2.65
2.55
150
150
1.2
0.3
0.3
50
50
11
16
11
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8
2
1.515
MAX
0.14
0.16
0.23
0.30
4.00
4.00
2.80
2.70
160
155
5.5
5.0
60
55
14
21
11
14
3
UNITS
mV
mV
mA
mA
µA
µA
°C
V
A
V
V

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