CN22JTN103 TA-I TECHNOLOGY CO., LTD, CN22JTN103 Datasheet - Page 5

• Manufacturer Part Number: CN22JTN103
• Description: Thick Film Chip Resistor Arrays Thick Film Chip Resistor Networks
• Manufacturer: TA-I TECHNOLOGY CO., LTD

Whisker
Resistance to Solder Heat
6.Marking : No Marking for CN22
7. Taping & Reel :
TA-I
7.1 Taping Dimensions
Note* : RCWV : Rated continuous working voltage
7.1.1 2 mm pitch paper
Thick Film Chip Resistor Networks
Thick Film Chip Resistor Arrays
SONY
SS-00254-8
SONY
SS-00254-5
(Lead-Free for CN22 Series)
Component , Lead-Free Soldering part 8 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Temp. Cycles :
-55
Testing duration : 500
Temp. Humidity Chambers:
Temperature : 85
Humidity : 85% RH
Testing duration : 500
Component , Lead-Free Soldering part 5 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Flow Solder :
Pre – heat : 100 to 105
Temperature : 260
The entire sample shall be dipped in solder.
The specimen shall be stored at standard
atmospheric conditions for 1 hour .
Iron Solder :
Bit temperature : 350
Application time of soldering iron : 3 +1/- 0sec
Apply the soldering iron to the electrode .
The specimen shall be stored at standard
atmospheric conditions for 1 hour , after
which the measurements shall be made
℃
( 30 min.) / +155
℃
.
±
TA-I TECHNOLOGY CO., LTD
3
℃
±
±
℃
4 hours
4 hours
( 30 min. )
±
1 0
10 +1/ -0 sec
℃
℃
30
±
5 sec
UNIT: mm
Whisker formation :
Electrical characteristics shall be
Satisfied .
Without distinct deformation in
appearance
50 um or less .
page
No
TCN-220S002E
5/10