ULLC0402FC05C-T710-2 Protek Devices, ULLC0402FC05C-T710-2 Datasheet

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Only One Name Means ProT ek’Tion™ UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers ✔ SMART Cards IEC COMPA TIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, ...

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DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART STAND-OFF NUMBER (See Note 1) VOLTAGE ULLC0408FC05C Note 1: This device is bidirectional. FIGURE 1 OVERSHOOT ...

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APPLICA TION INFORMA TION Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder ...

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PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE MOUNTING PAD LA YOUT - Option SOLDER PRINT 0.010” - 0.012” DIA. 05221.R0 4/05 TOP E F Metalized Die Contact END I A SOLDER PADS SOLDER MASK 4 ULLC0408FC05C* PACKAGE DIMENSIONS ...

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... COPPER CONTACT 0.009” [0.23] DIA. I SOLDER PRINT 0.014” [0.36] DIA. COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’ ...