TEA6880 Philips Semiconductors, TEA6880 Datasheet - Page 2

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TEA6880

Manufacturer Part Number
TEA6880
Description
Up-level Car radio Analog Signal Processor CASP
Manufacturer
Philips Semiconductors
Datasheet

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Philips Semiconductors
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
7.5.6
7.5.7
7.5.8
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
11.14
11.15
11.16
2000 May 08
Up-level Car radio Analog Signal
Processor (CASP)
FEATURES
General
Stereo decoder and noise blanking
Weak signal processing
Audio pre-amplifier
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Stereo decoder
FM noise blanker
AM noise blanker
Multipath/fading detection and weak signal
control
Tone/volume control
Source selector
Loudness
Volume 1
Treble
Bass
Volume 2
RSA selector
Chime adder
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I
Read mode: 1st data byte
Read mode: 2nd data byte
Subaddress byte for write
Write mode: subaddress 0H
Write mode: subaddress 1H
Write mode: subaddress 2H
Write mode: subaddress 3H
Write mode: subaddress 4H
Write mode: subaddress 5H
Write mode: subaddress 6H
Write mode: subaddress 7H
Write mode: subaddress 8H
Write mode: subaddress 9H
Write mode: subaddress AH
Write mode: subaddress BH
Write mode: subaddress CH
2
C-BUS PROTOCOL
2
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
INTERNAL CIRCUITRY
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
Product specification
2
TEA6880H
C COMPONENTS

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