HFBR-5104 Agilent(Hewlett-Packard), HFBR-5104 Datasheet - Page 8

• Manufacturer Part Number: HFBR-5104
• Description: FDDI/ 100 Mbps ATM/ and Fast Ethernet Transceivers in Low Cost 1x9 Package Style
• Manufacturer: Agilent(Hewlett-Packard)

ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommenda-
tion is in keeping with good high
frequency board layout practices.
Board Layout - Hole Pattern
The Hewlett-Packard transceiver
complies with the circuit board
“Common Transceiver Footprint”
hole pattern defined in the
original multisource announce-
ment which defined the 1x9
package style. This drawing is
reproduced in Figure 8 with the
addition of ANSI Y14.5M
compliant dimensioning to be
used as a guide in the mechanical
layout of your circuit board.
Figure 8. Recommended Board Layout Hole Pattern
(8X)
20.32
.800
2.54
.100
20.32
.800
Board Layout - Art Work
The Applications Engineering
group has developed Gerber file
artwork for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Hewlett-
Packard sales representative for
details.
Board Layout - Mechanical
For applications providing a
choice of either a duplex SC or a
duplex ST connector interface,
while utilizing the same pinout on
the printed circuit board, the ST
port needs to protrude from the
chassis panel a minimum of
9.53 mm for sufficient clearance
to install the ST connector.
Please refer to Figure 8a for a
mechanical layout detailing the
TOP VIEW
(9X) ø
(2X) ø
Ø0.000 M A
Ø0.000 M A
.032 ± .004
.075 ± .004
0.8 ± 0.1
1.9 ± 0.1
recommended location of the
duplex SC and duplex ST trans-
ceiver packages in relation to the
chassis panel.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various international regulations
governing certification of
Information Technology
Equipment. See the Regulatory
Compliance Table for details.
Additional information is
available from your Hewlett-
Packard sales representative.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
–A–
133