HFBR-5203 Agilent(Hewlett-Packard), HFBR-5203 Datasheet - Page 7

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HFBR-5203

Manufacturer Part Number
HFBR-5203
Description
ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style
Manufacturer
Agilent(Hewlett-Packard)
Datasheet
              
         
Figure 7. Recommended Decoupling and Termination Circuits.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout - Decoupling
Circuit and Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these transceivers. Figure 7
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
NO INTERNAL CONNECTION
V
Rx
R6
EE
1
RD
R5
RD
2
V
CC
C6
RD
R7
RD
3
R8
        
SD
SD
4
HFBR-520X
TOP VIEW
R10
R9
C1
TRANSCEIVER
V
AT V
C3
Rx
V
CC
5
provides a good example of a
schematic for a power supply
decoupling circuit that works well
with these parts. It is further
recommended that a contiguous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommen-
dation is in keeping with good
high frequency board layout
practices.
CC
L1
V
CC
FILTER
CC
PINS
NO INTERNAL CONNECTION
V
Tx
CC
6
C4
L2
C2
TD
7
TD
TERMINATION
AT TRANSCEIVER
INPUTS
R1
TD
R2
8
V
CC
V
Tx
C5
R3
EE
9
R4
TD
Board Layout - Hole Pattern
The Hewlett-Packard transceiver
complies with the circuit board
“Common Transceiver Footprint”
hole pattern defined in the
original multisource
announcement which defined the
1x9 package style. This drawing
is reproduced in Figure 8 with the
addition of ANSI Y14.5M
compliant dimensioning to be
used as a guide in the mechanical
layout of your circuit board.
113

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