AD8001A Analog Devices, AD8001A Datasheet - Page 3

• Manufacturer Part Number: AD8001A
• Description: 800 Mhz, 50 MW Current Feedback Amplifier
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . 1.2 V
Output Short Circuit Duration
Storage Temperature Range N, R . . . . . . . . . –65 C to +125 C
Operating Temperature Range (A Grade) . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 C
NOTES
1
2
Model
AD8001AN
AD8001AQ
AD8001AR
AD8001AR-REEL
AD8001AR-REEL7
AD8001ART-REEL
AD8001ART-REEL7
AD8001ACHIPS
5962-9459301MPA
AD8001R-EB+2
NOTES
1
2
REV. C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8001 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air:
Standard Military Drawing Device.
Refer to Evaluation Board section.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
8-Lead Plastic DIP Package:
8-Lead SOIC Package:
8-Lead Cerdip Package:
5-Lead SOT-23-5 Package:
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W
SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
2
1
JA
JA
= 155 C/W
= 110 C/W
JA
JA
= 260 C/W
2
= 90 C/W
Temperature
Range
–40 C to +85 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
1
ORDERING GUIDE
V
S
Package
Description
8-Lead Plastic DIP
8-Lead Cerdip
8-Lead SOIC
13" Tape and REEL
7" Tape and REEL
13" Tape and REEL
7" Tape and REEL
Die Form
8-Lead Cerdip
SOIC Evaluation Board, G = +2
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8001 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately +150 C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175 C for an extended
period can result in device failure.
While the AD8001 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (+150 C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
2.0
1.5
1.0
0.5
–50
0
–40
–30
SOIC PACKAGE
SOT-23-5 PACKAGE
–20
8-LEAD
–10
AMBIENT TEMPERATURE – C
5-LEAD
0
10
20 30 40
WARNING!
PLASTIC DIP PACKAGE
Package
Option
N-8
Q-8
SO-8
SO-8
SO-8
RT-5
RT-5
Q-8
8-LEAD
50 60
ESD SENSITIVE DEVICE
T
J
AD8001
= +150 C
70
80
Brand
Code
HEA
HEA
90