BGA2771 Philips Semiconductors (Acquired by NXP), BGA2771 Datasheet - Page 3

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BGA2771

Manufacturer Part Number
BGA2771
Description
BGA2771; Mmic Wideband Amplifier;; Package: SOT363 (UMT6)
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BGA2771
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BGA2771,115
Manufacturer:
LT
Quantity:
5 560
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
CHARACTERISTICS
V
2002 Aug 06
V
I
P
T
T
P
R
I
R
R
NF
BW
P
P
IP3
IP3
S
S
S
SYMBOL
SYMBOL
SYMBOL
s
stg
j
S
tot
D
L(sat)
L 1 dB
th j-s
L IN
L OUT
MMIC wideband amplifier
21
= 3 V; I
(in)
(out)
2
S
= 33 mA; f = 1 GHz; T
DC supply voltage
supply current
total power dissipation
storage temperature
operating junction temperature
maximum drive power
thermal resistance from junction to
solder point
supply current
insertion power gain
return losses input
return losses output
noise figure
bandwidth
saturated load power
load power
input intercept point
output intercept point
PARAMETER
PARAMETER
PARAMETER
j
= 25 C; unless otherwise specified.
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
at s
f = 1 GHz
f = 2 GHz
at 1 dB gain compression; f = 1 GHz
at 1 dB gain compression; f = 2 GHz
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
21
2
3 dB below flat gain at 1 GHz
CONDITIONS
RF input AC coupled
T
P
s
tot
3
= 200 mW; T
80 C
CONDITIONS
CONDITIONS
s
80 C
29
MIN.
33.3
21.4
20.8
17
13
9
9
4.5
4.7
2.4
13.2
10.5
12.1
8.4
0.5
21.9
16.5
65
4.3
MIN.
TYP.
Product specification
4
50
200
+150
150
10
45
VALUE
MAX.
MAX.
BGA2771
300
V
mA
mW
dBm
mA
dB
dB
dB
dB
dB
dB
dB
dB
GHz
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
C
C
UNIT
UNIT
UNIT
K/W

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