BGA2802 Philips Semiconductors (Acquired by NXP), BGA2802 Datasheet - Page 2

• Manufacturer Part Number: BGA2802
• Manufacturer: Philips Semiconductors (Acquired by NXP)

NXP Semiconductors
3. Ordering information
4. Marking
5. Limiting values
6. Thermal characteristics
7. Characteristics
Table 6.
V
BGA2802
Product data sheet
Symbol Parameter
V
I
CC
CC
CC
= 3.3 V; Z
supply voltage
supply current
Characteristics
S
= Z
L
= 50
Table 2.
Table 3.
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 5.
Type number
BGA2802
Type number
BGA2802
Symbol
V
I
P
T
T
P
Symbol
R
Ω
CC
stg
j
CC
tot
drive
th(j-sp)
; P
i
=
−
40 dBm; T
Ordering information
Marking
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction to
solder point
Parameter
supply voltage
supply current
total power dissipation
storage temperature
junction temperature
drive power
All information provided in this document is subject to legal disclaimers.
Package
Name
-
amb
= 25
Rev. 1 — 24 February 2011
Marking code
MA*
Conditions
°
C; measured on demo board; unless otherwise specified.
Description
plastic surface-mounted package; 6 leads
Conditions
RF input AC coupled
T
sp
= 90 °C
Conditions
P
tot
= 200 mW; T
Description
* = - : made in Hong Kong
* = p : made in Hong Kong
* = W : made in China
* = t : made in Malaysia
sp
= 90 °C
MMIC wideband amplifier
Min
3.0
9.8
BGA2802
Min
−0.5
-
-
−40
-
-
Typ
3.3
12.5
© NXP B.V. 2011. All rights reserved.
Typ
300
Max
3.6
55
200
+125
125
−16.5
Max
3.6
15.2
Version
SOT363
Unit
K/W
Unit
V
mA
mW
°C
°C
dBm
2 of 18
Unit
V
mA