ADA4937-1 Analog Devices, ADA4937-1 Datasheet - Page 7

• Manufacturer Part Number: ADA4937-1
• Description: Ultra-Low Distortion Differential ADC Driver
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL RESISTANCE
θ
soldered to a high thermal conductivity 2s2p circuit board,
as described in EIA/JESD 51-7.
Table 6. Thermal Resistance
Package Type
16-Lead LFCSP (Exposed Pad)
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4937-1
package is limited by the associated rise in junction
temperature (T
which is the glass transition temperature, the plastic
changes its properties. Even temporarily exceeding this
temperature limit can change the stresses that the package
exerts on the die, permanently shifting the parametric
performance of the ADA4937-1. Exceeding a junction
temperature of 150°C for an extended period can result in
changes in the silicon devices, potentially causing failure.
JA
is specified for the device (including exposed pad)
J
) on the die. At approximately 150°C,
θ
95
JA
Rating
5.5 V
See Figure 3
−65°C to +125°C
−40°C to +105°C
300°C
150°C
Unit
°C/W
Rev. 0 | Page 7 of 28
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through holes, ground,
and power planes reduces the θ
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
(95°C/W) on a JEDEC standard 4-layer board.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
–45
–35
–25
–15
–5
AMBIENT TEMPERATURE (°C)
5
S
) times the quiescent current (I
15
25
JA
.
35
45
D
) is the sum of the
55
65
75
85
ADA4937-1
95
105
JA
. In
S
).