MTSF2P02HDR2 ON Semiconductor, MTSF2P02HDR2 Datasheet
MTSF2P02HDR2
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MTSF2P02HDR2 Summary of contents
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... STYLE Date Code PIN ASSIGNMENT Source 1 2 Source Source 3 Gate 4 Top View ORDERING INFORMATION Device Package MTSF2P02HDR2 Micro8 Preferred devices are recommended choices for future use and best overall value. 1 Publication Order Number: MARKING DIAGRAM Drain 7 Drain Drain 6 Drain ...
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MAXIMUM RATINGS ( unless otherwise noted) Negative sign for P–Channel devices omitted for clarity Drain–to–Source Voltage Drain–to–Gate Voltage ( 1 Gate–to–Source Voltage – Continuous 1 SQ. FR–4 or G–10 PCB Figure 1 ...
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ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc ...
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TYPICAL ELECTRICAL CHARACTERISTICS Figure 3. On–Region Characteristics Figure 5. On–Resistance versus Gate–to–Source Voltage Figure 7. On–Resistance Variation with Temperature MTSF2P02HD Figure 4. Transfer Characteristics Figure 6. On–Resistance versus Drain Current and Gate Voltage Figure 8. Drain–to–Source Leakage Current versus Voltage ...
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Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are determined by how fast the FET input capacitance can be charged by current from ...
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... A ratio considered ideal and values less than 0.5 are considered snappy. Compared to ON Semiconductor standard cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter have less stored charge and a softer reverse recovery characteristic ...
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The Forward Biased Safe Operating Area curve (Figure 14) defines the maximum simultaneous drain–to–source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case ...
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MTSF2P02HD TYPICAL ELECTRICAL CHARACTERISTICS Figure 15. Thermal Response Figure 16. Diode Reverse Recovery Waveform http://onsemi.com 8 ...
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INFORMATION FOR USING THE Micro8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure ...
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For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings ...
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Micro8 Dimensions are shown in millimeters (inches) 4.10 (.161) PIN NUMBER 1 3.90 (.154) 12.30 11.70 (.484) (.461) FEED DIRECTION NOTES: 1. CONFORMS TO EIA–481–1. 2. CONTROLLING DIMENSION: MILLIMETER. 330.0 (13.20) MAX. NOTES: 1. CONFORMS TO EIA–481–1. 2. CONTROLLING DIMENSION: ...
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... Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST) Email: ONlit–spanish@hibbertco.com Toll–Free from Mexico: Dial 01–800–288–2872 for Access – ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: 001– ...