TS4962 ST Microelectronics, Inc., TS4962 Datasheet - Page 23

• Manufacturer Part Number: TS4962
• Manufacturer: ST Microelectronics, Inc.

Package Mechanical Data
4.2 FLIP CHIP - 9 BUMPS
0.5mm
0.5mm
1.60 mm
1.60 mm
0.5mm
0.5mm
0.25mm
0.25mm
600µm
600µm
1.60 mm
1.60 mm
100µm
100µm
*Back Coating layer Height : 100 m 10 m
* Optional
Die size : 1.6mm x 1.6mm
Die height (including bumps) : 600 m
Bump diameter : 315 m 50 m
Bump diameter before Reflow : 300 m 10 m
Bump height: 250 m
Die Height: 350 m
Pitch: 500 m 50 m
Coplanarity: 60 m max
0 m
0 m
m
TS4962
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